Infineon ESD200-B1-CSP0201E6327: High-Performance ESD Protection Diode for Ultra-Compact Circuit Designs

In the rapidly evolving world of electronics, protecting sensitive components from electrostatic discharge (ESD) is a critical design challenge. As devices shrink and circuits become denser, the demand for robust yet miniature protection solutions has never been greater. Addressing this need, Infineon Technologies introduces the ESD200-B1-CSP0201E6327, a state-of-the-art ESD protection diode engineered for ultra-compact circuit designs.

This device stands out with its remarkably small 0201 package size (0.6 x 0.3 x 0.3 mm), making it one of the smallest ESD protection components available on the market. Its minuscule footprint is ideal for space-constrained applications such as smartphones, wearables, IoT modules, and other portable consumer electronics where every millimeter of board space is precious.

Despite its tiny size, the ESD200-B1-CSP0201E6327 delivers exceptional protection performance. It is designed to safeguard sensitive ICs and interfaces against ESD strikes exceeding ±30 kV (air gap, IEC 61000-4-2), ensuring high reliability and durability. The diode features an ultra-low clamping voltage, which swiftly diverts ESD transients away from the protected circuit, minimizing the stress on downstream components. Furthermore, it boasts an extremely low leakage current and minimal capacitance, typically below 0.5 pF. This low capacitance is crucial for preserving signal integrity in high-speed data lines, including USB 3.0, HDMI, and high-frequency RF antennas, without causing distortion or attenuation.

The component is bidirectional, simplifying design and layout by providing protection for both positive and negative voltage transients without requiring a specific orientation relative to the supply voltage. Its construction on a advanced silicon technology ensures consistent performance and high robustness, meeting stringent automotive and industrial quality standards.

ICGOOODFIND: The Infineon ESD200-B1-CSP0201E6327 is a pinnacle of miniaturization and performance, offering best-in-class ESD protection for next-generation electronics. Its combination of a microscopic form factor, superior clamping capability, and minimal impact on signal integrity makes it an indispensable component for designers aiming to enhance reliability without compromising on space.

Keywords: ESD Protection, Ultra-Compact, 0201 Package, Low Capacitance, High-Speed Data Lines